Form 9.B Project Summary

Chron: 972417

Proposal Number: 20.07-1980A

Project Title: High Thermal Conductivity C-C Composites For Chip-On Structure

Technical Abstract (Limit 200 words)

C-C composites offer excellent thermal, mechanical and outgasing properties. Their commercial application in electronics is extremely limited due to their high cost. MER has developed a new process, which has the potential to produce C-C composites at $50/lb. This proposal seeks innovative solutions to extend this new technology to space applications, by providing dual (structural, electronic) usage of low CTE C-C composite optical benches. Novel approaches are sought to address the issue of strain isolation (CVD carbon) and dielectric insulation (polymeric coating). It is anticipated that this new technology will provide clear advantage over printed wiring boards (PWBs) in chip-on-based applications.

Potential Commercial Applications (Limit 200 words)

The low-cost, C-C composite based integrated substrate has enormous (over $1 billion) applications in microelectronics such as chip-on-board (COB) and multi-chip-module-laminate (MCM-L). Specific applications include portable electronics, micro processors, and commercial avionics.

Name and Address of Principal Investigator (Name,

Organization Name, Mail Address, City/State/Zip)

Dr. Witold Kowbel

Materials& Electrochemical Research (MER)

Corporation

7960 S. Kolb Rd.

Tucson , AZ 85706

Name and Address of Offeror (Firm Name, Mail Address,

City/State/Zip)

Dr. J.C.Withers

Materials& Electrochemical Research (MER)

Corporation

7960 S. Kolb Rd.

Tucson , AZ 85706