SBIR 95-1 SOLICITATION
IMPROVED THERMAL EFFICIENCY OF MICROWAVE AND MULTICHIP MODULES
The marriage of industrial CVD diamond film wafer, the low temperature co-fired ceramic (LTCC) and the MMIC technologies will improve the thermal efficiencies of transmit/receive modules, high speed integrated circuits and power supplies and will allow greater packaging efficiency, without increasing in size, weight and power consumption of the module; making them more attractive in space, airborne and commercial communications markets. Industrial CVD diamond will be used as substrates with thin film technology in conjunction with MMIC technologies and three dimensional packaging using diamond heat sinks will lead to excellent reliability.
Thermal issues of high dissipation devices, such as microwave devices, have always been critical to system designers. This proposal addresses the design of packages that will be useful for high frequency applications. In addition derivatives of the packaging will be addressed towards the low frequency end where fast microprocessors can use the product without sacrificing any performance. Large volume applications exist in Phase Array Radar, Personal communications and Computer products. In Commercial applications, such as cellular telephones, Efficient thermal packages prolong the life of the MMIC amplifier. This package will have a universal applications market.
Potential Commercial Applications:
The development of the package, with the goal of low cost and high performance, will find high volume markets spanning from 50 Mhz to well over 20 Ghz .The markets addressed will consist of personal communications, computer chip and microwave T/R module.
Name and Address of Offeror:
Mr. Sarjit Singh Bharj
3 Nami Lane
Mercerville, NJ 08619
Small Business Innovation Research Program (SBIR) &
Small Business Technology Transfer Program (STTR) Programs
Electronic Management System (EMS)
National Aeronautics and Space Administration (NASA)
The SBIR/STTR EMS site is maintained by Steve
Hu, Hughes STX.
For comments and questions, contact
Updated: Feb. 7, 1996