Low Thermal Conductance HTSC Electrical Connections Array for Cryogenic Detector Systems
94-1 08.07 1100A
Low Thermal Conductance HTSC Electrical Connections Array for
Cryogenic Detector Systems
Space mission lifetime is limited by the evaporation of the
liquid helium cryogen required for optimum performance of super
sensitive far infra-red (IR) systems. The largest non parasitic
heat load on the dewar system results from the electrical
connections between the sensors (4K) and the data acquisition
electronics maintained at higher temperatures (80K). Currently
used Manganin wires comprise approximately 20% of total heat load
on liquid dewar system. We propose to reduce this heat load by
employing HTSC leads, due to their extremely low thermal
conductivity and zero resistance at cryogenic temperatures. This
idea was previously implemented at NASA linear array consisting
of thick screen-printed YBCO films, which reduced heat load by
10%. We propose to reduce further this heat load by two orders
of magnitude by fabricating a high density linear array of thin
HTSC electrical connections. The Phase I program will demonstrate
the feasibility of fabrication by MOCVD and device processing.
Phase II will develop methods for producing flexible high density
Proposed high density linear array and especially flexible high
density array will find wide application in any cryostat system
when deep cryogen cooling is required for optimum performance.
Among the devices to benefit are super sensitive far infra-red
(IR) systems, SQUIDs, devices based on nuclear magnetic resonance
and sensor part of superconducting magnets.
Advanced Technology Materials, Inc.
7 Commerce Drive
Danbury, CT 06810