Project Title:

Photoelectrochemically Etched Microchannel Plates

EIC Laboratories, Inc.
111 Downey Street
Norwood, MA 02062

93-1-08.29-9450

Photoelectrochemically Etched Microchannel Plates

Abstract:

The microchannel plate (MCP) is one of the most important
components in spectroscopic systems for characterization of deep
space radiation such as the Extreme Ultraviolet Explorer. The MCP
requires an array of high aspect ratio channels in a substrate
with conductors on the front and back faces. We propose a novel,
potentially rapid and highly economical method for fabricating
these structures using light-driven etching of silicon wafers.
The method promises to provide holes <10 um wide and with <5 um
walls, structures which cannot be achieved using presently known
chemical etching techniques. The availability of MCPs with such
high resolution channels and high fraction of channel to wall
space will enable much improved resolution over current cored
glass MCPs. Phase I will have the objective of demonstrating the
feasibility of photoelectrochemical etching of 10 x 10 um square
holes through a 50 um single crystal Si wafer and establishing
the minimum wall width for a favorable set of
photoelectrochemical etching parameters. Phase II would then be
directed at perfecting the process, extending it to larger areas,
and to processing the MCPs into full image intensifiers.

Microchannel plates have applications in astronomy, spectroscopy
and night and low light vision systems.

Microchannel Plate, Image Intensivier, Ultraviolet, Silicon,
Etching