Project Title:

Low-Cost, High-Performance Multichip Packages for Monolithic Microwave Integrated Circuits

92-1-14.05-3200                                                   NAS03-26405
Low-Cost, High-Performance Multichip Packages for
     Monolithic Microwave Integrated Circuits
Foster-Miller, Inc.
350 Second Avenue
Waltham, MA  02154-1196
K. Jayaraj                                           (617-890-3200)

Abstract:

     The goal of this project is to combine the unique properties
of liquid crystalline polymers (LCP) with high conductivity
substrates to develop a multichip package for monolithic microwave
integrated circuits (MMICs). The approach will use coplanar, wave-
guide transmission lines on a barrier LCP film to provide chip-to-
chip RF connections and impedance-controlled off-package
transitions. The superior dielectric properties of LCPs, combined
with their excellent barrier properties, make this approach
feasible. Phase I will conduct design and material tradeoffs and
fabricate a test structure to characterize the IC-to-interconnect
and interconnect-to-board transitions and the ability of LCPs to
protect ICs. In Phase II, the firm will team with Honeywell to
further develop and commercialize this technology by designing,
fabricating, and testing a multichip package containing several
MMICs. This development will result in a low-cost, low-weight, and
high-performance multichip package for packaging phased-array
antennas for NASA missions such as the Mars Rover and Mission
Planet Earth.

Potential Commercial Application:

Potential Commercial Applications:  This development will have
specific commercial applications in receiver front-ends for direct
satellite-to-home TV, in instrumentation where cost and circuit
packaging density are important, and in mobile communications.

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