Project Title:

Thermal Tile Bond Inspection

13.04-6000
Thermal Tile Bond Inspection 
Spire Corporation
Patriots Park
Bedford
MA
01730
Charles C.
Blatchley
(617-275-6000)
KSC

Abstract:

During adhesive bonding of specially machined insulating tiles to Space Shuttle Orbiter,
the adhesive may crack, form voids, or simply fail to bond tightly to the surface.
The goal of this project is to provide a reliable, nondestructive technique to determine
the existence or size of bonding defects by applying gamma-ray scatter counting used
widely to measure thickness and composition of thin-film coatings. Unlike conventional
radiography or radiometry, gamma-ray scattering requires access to just one surface
and, through proper collimation, can be made to ignore surface features and sense
only defects in a layer deep under the surface. The apparatus for scanning these
deep layers can be made extremely rugged and lightweight; detectors and electronics
similar to those required for a hand-held inspection unit have been successfully
boosted into space.
In Phase I, a breadboard gamma scatter unit will be tested for capability of characterizing
condition of a layer of adhesive material. A prototype inspection device will be
developed in Phase II.

Potential Commercial Application:

Potential Commercial Applications:  This approach for non-destructive inspection
may also apply to industrial manufacturing, assembly, and operational inspections
for other laminated configurations.