NASA SBIR 2019-I Solicitation

Proposal Summary

PROPOSAL NUMBER:
 19-1- A1.04-4350
SUBTOPIC TITLE:
 Electrified Aircraft Propulsion
PROPOSAL TITLE:
 Binder Jet Additive Manufacturing of Silicon Carbide Heat Exchangers
SMALL BUSINESS CONCERN (Firm Name, Mail Address, City/State/Zip, Phone)
The ExOne Company
127 Industry Boulevard
North Huntingdon, PA 15642- 3461
(724) 863-9663

Principal Investigator (Name, E-mail, Mail Address, City/State/Zip, Phone)

Name:
Mr. Jesse Blacker
E-mail:
Jesse.Blacker@exone.com
Address:
127 Industry Blvd North Huntingdon, PA 15642 - 3461
Phone:
(724) 610-4778

Business Official (Name, E-mail, Mail Address, City/State/Zip, Phone)

Name:
Mr. Jesse Blacker
E-mail:
Jesse.Blacker@exone.com
Address:
127 Industry Blvd North Huntingdon, PA 15642 - 3461
Phone:
(724) 610-4778
Estimated Technology Readiness Level (TRL) :
Begin: 3
End: 5
Technical Abstract (Limit 2000 characters, approximately 200 words)

ExOne is proposing to develop its Binder Jetting Additive Manufacturing process for silicon carbide recuperators in support of NASA Electrified Aircraft Propulsion (EAP) initiatives. Lighter weight, higher efficiency, high temperature heat exchangers have been identified as a need in the A1.04 subtopic.  ExOne will demonstrate the technical feasibility of using AM to build silicon cardide heat exchangers by optimizing print parameters and post processing techniques to maximize the SiC volume fraction in the final material. ExOne will characterize the materials and demonstrate a sub scale heat exchanger component to show the potential to create highly complex shapes in silicon carbide quickly and cost effectively.  Phase II will focus on scale up and a full recuperator prototype demonstartion and validation. 

Potential NASA Applications (Limit 1500 characters, approximately 150 words)

Heat exchangers, recuperators, optics (mirrors and support structures), high temperature structural materials for hypersonic applications. 

Potential Non-NASA Applications (Limit 1500 characters, approximately 150 words)

Semiconductors, semiconductor tooling, high temperature furnace components, 

Duration: 6
Form Generated on 06/16/2019 23:20:49