NASA STTR 2018-II Solicitation

Proposal Summary


PROPOSAL NUMBER:
 18-2- T12.02-4053
PHASE 1 CONTRACT NUMBER:
 80NSSC18P2119
SUBTOPIC TITLE:
 Extensible Modeling of Metallurgical Additive Manufacturing Processes
PROPOSAL TITLE:
 Sentient Science - A Multiscale Modeling Suite for Process and Microstructure Prediction in Metal Additive Manufacturing
SMALL BUSINESS CONCERN (SBC):
Sentient Science
672 Delaware
Buffalo NY  14209 - 0000
Phone: (716) 239-8215
RESEARCH INSTITUTION (RI):
University of Nebraska - Lincoln
Nebraska Hall (NH) W340
NE  68588 - 0526
Phone: (402) 472-1659

Principal Investigator (Name, E-mail, Mail Address, City/State/Zip, Phone)

Name:
Mr. Jingfu Liu
E-mail:
jliu@sentientscience.com
Address:
672 Delaware Buffalo, NY 14209 - 0000
Phone:
(832) 260-5660

Business Official (Name, E-mail, Mail Address, City/State/Zip, Phone)

Name:
Melissa McReynolds
E-mail:
mmcreynolds@sentientscience.com
Address:
672 Delaware Buffalo, NY 14209 - 0000
Phone:
(716) 239-8215
Estimated Technology Readiness Level (TRL) :
Begin: 5
End: 6
Technical Abstract (Limit 2000 characters, approximately 200 words)

In the Phase I period, Sentient upgraded its DigitalClone for Additive Manufacturing (AM) technology and successfully demonstrated and validated its “Process model” and “Microstructure model” for simulating metal AM processes. Sentient has partnered with University of Nebraska – Lincoln for model validation.

Specifically, Sentient has implemented a new “Process model” to predict part-level residual stress and distortion for parts built using AM processes. The new model shows high simulation efficiency and accuracy. In addition, Sentient has improved the simulation speed of its “Microstructure model” by 100% for predicting the grain structure and porosity.

The proposed DigitalClone for Additive Manufacturing (DCAM) simulation suite will fill the technical gap NASA is currently facing, and meet NASA’s requirement very well. The proposed solution allows NASA to: 1) simulate the part-level distortion and residual stress with respect to various key process parameters; 2) simulate the microstructure of as-built AM components with respect to key parameters and locations of interest; and 3) simulate the fatigue performance of as-built AM components at specific mechanical loading conditions. This physics-based simulation suite has been well demonstrated in different AM platforms (i.e. powder bed fusion and direct energy deposition) and several alloys systems that NASA is interested in. Those materials include Inconel 625, Inconel 718, 17-4 PH, 15-5 PH stainless steel, Ti64, and AlSi10Mg alloy. Additionally, the simulation suite can be applied to any new alloy with minimum calibration needed. This physics-based simulation suite directly benefits NASA via allowing computational testing for new component design, new materials, and new process, which will significantly reduce cost and time compared to conventional physical testing.

In the Phase II effort, Sentient will focus on developing of prototype software and further validating different materials and components.

 

 

Potential NASA Applications (Limit 1500 characters, approximately 150 words)

NASA is currently on a path to implement additive processes in space flight systems. The technology developed under this STTR will help NASA to successfully build components (e.g. MOXIE, SHERLOC, ion engines and other spacecraft structural) using additive manufacturing process at minimal cost and time. Relevant personnel in NASA Jet Propulsion Laboratory (JPL) have showed a strong interest in using the developed technology. 

Potential Non-NASA Applications (Limit 1500 characters, approximately 150 words)

The proposed software module will enable designers, AM suppliers, and operators/purchasers of AM components to expand their implementation of their strategies to take advantage of AM technology. Our initial target list includes customers in aerospace and defense that have ongoing AM initiatives and have already expressed some level of interest in our physics-based solutions.

Duration: 24

Form Generated on 11/19/2019 09:04:00