NASA SBIR 2016 Solicitation

SMALL BUSINESS CONCERN (Firm Name, Mail Address, City/State/Zip, Phone)
Global Technology Enterprises, Inc.
13 Lariat Loop
Bozeman, MT 59715 - 9200
(406) 640-1558

PRINCIPAL INVESTIGATOR/PROJECT MANAGER (Name, E-mail, Mail Address, City/State/Zip, Phone)
Todd Johnson
tjohnsongte@charter.net
13 Lariat Loop
Bozeman, MT 59715 - 9200
(406) 522-8027

CORPORATE/BUSINESS OFFICIAL (Name, E-mail, Mail Address, City/State/Zip, Phone)
Todd Johnson
tjohnsongte@charter.net
13 Lariat Loop
Bozeman, MT 59715 - 9200
(406) 522-8027

Estimated Technology Readiness Level (TRL) at beginning and end of contract:
Begin: 3
End: 4

Technology Available (TAV) Subtopics
LOX/Methane In-Space Propulsion is a Technology Available (TAV) subtopic that includes NASA Intellectual Property (IP). Do you plan to use the NASA IP under the award?
No

TECHNICAL ABSTRACT (Limit 2000 characters, approximately 200 words)
A Narloy-Z-diamond particulate composite providing increased thermal conductivity and light weight will be developed for use in liners for liquid rocket engine thrust chamber designs at similar cost to NarloyZ. Shortcomings of previous copper-diamond products have been poor resistance to thermal cycling and high cost. In the current work, attention will be given to developing a strong, chemically bonded metallurgical interface between the copper alloy and diamond phases to resist thermal cycle damage under operational conditions for the thrust chamber

POTENTIAL NASA COMMERCIAL APPLICATIONS (Limit 1500 characters, approximately 150 words)
Improved rocket nozzle liners for LOX/methane engine designs to replace existing high thermal conductivity materials such as Narloy Z with 50% increased thermal conductivity , lighter weight at similar cost . This approach can be used for any liquid rocket engines including heavy lift. Improved heat exchanger design for environment control for manned spaceflight

POTENTIAL NON-NASA COMMERCIAL APPLICATIONS (Limit 1500 characters, approximately 150 words)
Thermal management of electronic devices such as improved heat sinks and spreaders for motor drives CPUs, power electronics and photonics to replace existing Cu/Mo/Cu and copper tungsten composites,