NASA SBIR 2015 Solicitation

FORM B - PROPOSAL SUMMARY


PROPOSAL NUMBER: 15-1 S1.06-9561
SUBTOPIC TITLE: In Situ Sensors and Sensor Systems for Lunar and Planetary Science
PROPOSAL TITLE: A SiC-based Microcontroller for High-Temperature In-Situ Instruments and Systems

SMALL BUSINESS CONCERN (Firm Name, Mail Address, City/State/Zip, Phone)
Ozark Integrated Circuits, Inc.
700 West Research Center Boulevard
Fayetteville, AR 72701 - 7175
(479) 409-5201

PRINCIPAL INVESTIGATOR/PROJECT MANAGER (Name, E-mail, Mail Address, City/State/Zip, Phone)
Dr Anthony Matthew Francis
francis@ozarkic.com
700 W. Research Center Blvd.
Fayetteville, AR 72701 - 7175
(479) 575-1600

CORPORATE/BUSINESS OFFICIAL (Name, E-mail, Mail Address, City/State/Zip, Phone)
Dr Anthony Matthew Francis
francis@ozarkic.com
700 W. Research Center Blvd.
Fayetteville, AR 72701 - 7175
(479) 575-1600

Estimated Technology Readiness Level (TRL) at beginning and end of contract:
Begin: 2
End: 4

Technology Available (TAV) Subtopics
In Situ Sensors and Sensor Systems for Lunar and Planetary Science is a Technology Available (TAV) subtopic that includes NASA Intellectual Property (IP). Do you plan to use the NASA IP under the award?
No

TECHNICAL ABSTRACT (Limit 2000 characters, approximately 200 words)
NASA has a need for electronics that can support proposed flagship missions such as a Venus surface lander. Devices that can operate at temperatures of up to 500?C are desired. Ozark IC and its partner, the University of Arkansas, have created the world's largest known library of CMOS silicon-carbide (SiC) analog and mixed-signal circuits, intellectual property (IP) and packages that can operate at very high temperatures. The key next component is a general-purpose SiC microcontroller to provide real-time programmability for these SiC support circuits.

This Phase I proposal will use the extensive Ozark IC SiC library to develop a self-contained general-purpose SiC-CMOS microcontroller. When combined with data converters, gate drivers and other analog/mixed-signal circuitry, this microcontroller could serve in any number of high-temperature sample acquirement and analysis instruments.

POTENTIAL NASA COMMERCIAL APPLICATIONS (Limit 1500 characters, approximately 150 words)
NASA has demonstrated a resolve for a flagship mission in the coming years to revisit Venus, and land instruments on the surface. Venus has a corrosive, high-pressure (~100 bar), high-temperature (up to 500?C) environment.
NASA experts have stated that the single greatest challenge to providing devices operable at the Venusian surface is the availability of high-temperature digital, analog and mixed-signal electronics.

The SiC integrated circuit technology that Ozark IC is actively commercializing could easily meet NASA targets of 5-10 hours at 500?C with proper packaging.
By demonstrating the feasibility of a SiC microcontroller, this proposal represents a major step in creating a general-purpose SiC-based chipset that will support a majority of functions required by a Venus lander

POTENTIAL NON-NASA COMMERCIAL APPLICATIONS (Limit 1500 characters, approximately 150 words)
Other non-NASA applications are relatively obvious – they include any market that needs a programmable (radiation-hardened) microcontroller that will operate over a wide temperature range. These markets include, but are not limited to, Military Aerospace, Military/Non-Military Space Applications, Commercial Aviation and Oil Exploration, among others.

Ozark IC is continually being contacted by companies in these areas asking for these types of components that will operate over wide temperature ranges.

TECHNOLOGY TAXONOMY MAPPING (NASA's technology taxonomy has been developed by the SBIR-STTR program to disseminate awareness of proposed and awarded R/R&D in the agency. It is a listing of over 100 technologies, sorted into broad categories, of interest to NASA.)
Actuators & Motors
Circuits (including ICs; for specific applications, see e.g., Communications, Networking & Signal Transport; Control & Monitoring, Sensors)
Computer System Architectures
Data Acquisition (see also Sensors)
Data Fusion
Data Input/Output Devices (Displays, Storage)
Data Processing
Diagnostics/Prognostics
Sensor Nodes & Webs (see also Communications, Networking & Signal Transport)

Form Generated on 04-23-15 15:37