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Jet
Propulsion Laboratory
1993 Phase II
3-D Chip
Stacking to Build Cameras, Computers
Irvine
Sensors Corporation
Costa Mesa, CA
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INNOVATION
3-D stack technology for different
types of integrated circuits that can provide sugar cube size cameras
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3-D Stacked Module from Different
Integrated Circuits
Optional Powerpoint
file
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ACCOMPLISHMENTS
- Produced neo-wafers by potting
chips that can be thinned and stacked
- Re-routing the electrical connections
so that electrical connections can be made along the stacked edge
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COMMERCIALIZATION
- 3-D stacking technology basis
for $1.0 million contract with Boeing for miniature computer (mobile
voice activated computers for soldiers)
- Digital camera conversions for
35mm cameras
- Complex systems for portable
electronics
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GOVERNMENT/SCIENCE
APPLICATIONS
- Various NASA mission requiring
highly integrated instruments such as Mars landers and rovers
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| For
more information about this firm, please send e-mail to company
representative
Return
to NASA SBIR Success Listings
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Curator:
SBIR Support |
