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ARCHIVED
- Data Not Current
For Information Purposes
Only
Glenn
Research Center
1992 Phase II
Near Hermetic
Packaging Technology for MMIC Devices
Foster-Miller,
Inc.
Waltham, MA
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INNOVATION
Excellent Electrical and barrier properties
of Liquid Crystal Polymers (LCP) are exploited to provide Light Weight,
Low Cost, Near-Hermetic Packages for High Frequency Applications
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High Frequency LCP Package
Optional Powerpoint
file
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ACCOMPLISHMENTS
- Developed processes to fabricate
low loss, controlled impedance transmission lines on LCP films
- Packaged and Tested a Triquint
Low Noise Amplifier (LNA) using flip chip technology.
Coefficient of Thermal Expansion matched LCP substrate did
not require underfilling
- Interconnected receiver circuit
elements (mixer, LNA) on an LCP substrate and tested up to
20 GHz
- Packages are 50% less weight
with potential to achieve 75% reduction in cost compared to
hybrid technology
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COMMERCIALIZATION
- Triquint Inc. interested in
using the technology to package their integrated circuits
- Teledyne Electronic Technologies
interested to be a vendor of substrates to the industry
- Superex, a Foster-Miller subsidiary,
created to commercialize the LCP technology, added three new
employees
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GOVERNMENT/SCIENCE
APPLICATIONS
- LCP technology is suitable for
transmit/receive (T/R) modules. Applications include NASA
communication satellites, and other communication satellite systems
such as Iridium, Teledesic, etc
- Use of LCP technology for packaging
will reduce the cost and weight of air-borne and space-borne electronic
systems
- Keen interest to extend the
technology to digital, and mixed signal applications and ball grid
array, chip scale and built-up laminate technologies
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information about this firm, please send e-mail to company
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