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Goddard
Space Flight Center
1989 Phase II
Solid-State
Data Recorder
Irvine
Sensors Corporation
Costa Mesa, CA
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INNOVATION
Three dimensional, solid state, multi-ported
memory system that provides faster processing speeds, higher of integration,
and lower power requirements than conventional chip sets
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Short Stack Application for Solid-State
Recorder
Optional Powerpoint
file
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ACCOMPLISHMENTS
- Three dimensional cubing process
reduces dramatically the size and weight of memory-intensive instruments
- Engineered a stack the size of a
sugar cube to replace a PC's main circuit board
- Developed Memory Short StackTM
which consists of memory chips in a "pancake stack" configuration
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COMMERCIALIZATION
- Two licensing agreements and
a joint development agreement with IBM for several related products
- The firm's patented, SBIR-funded
3D silicon stacking process is now used for DRAM, SRAM, and Flash
Memory modules, with other high density stacked products in development
- Commercialization product sales
of $2M in 1995, $6 M in 1996, and projected 1997 revenues of $8
M
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GOVERNMENT/SCIENCE
APPLICATIONS
- First spaceborne short stacks
are part of the Lockheed Sanders solid state recorder aboard the
Chilean Air Force satellite launched in August 1995
- Scheduled for flight in SSTI
Lewis mission and Landsat 7 solid state data recorder
- Phase II program in progress
that will combine detectors and memory and result in imaging short
stacks for electronic still cameras
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